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MT53D1024M32D4DT-053 AAT:D

MT53D1024M32D4DT-053 AAT:D

  • 厂商:

    MICRON(镁光)

  • 封装:

    -

  • 描述:

    MT53D1024M32D4DT-053 AAT:D

  • 详情介绍
  • 数据手册
  • 价格&库存
MT53D1024M32D4DT-053 AAT:D 数据手册
MT53D1024M32D4DT-053 AAT Orderable parts MT53D1024M32D4DT-053 AAT:D RoHS China RoHS Certificate Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. • File Type: (PDF) • Updated: 8/1/2022 Download RoHS Certificate of Compliance Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions. • File Type: (PDF) • Updated: 8/1/2022 Download REACH Statement Company statement regarding REACH SVHC compliance • File Type: (PDF) • Updated: 8/1/2022 Download Simulation Models HSPICE: 8Gb Mobile LPDDR4 Z11M WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b • File Type: ZIP • Updated: 2020-10-06 Download IBIS: 8Gb Mobile LPDDR4 Z11M WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b • File Type: ZIP • Updated: 2020-10-06 Download Technical Notes TN-00-08: Thermal Applications This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. • File Type: PDF • Updated: 2021-11-16 Download TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications This technical note describes the quality and reliability requirements for bare die applications. • File Type: PDF Updated: 2009-10-15 Download • See All Customer Service Notes CSN-16: Micron Component and Module Packaging Explanation of Micron packaging labels and procedures. • File Type: PDF • Updated: 2021-12-06 Download CSN-24: ESD Precautions for Die/Wafer Handling and Assembly Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. • File Type: PDF • Updated: 2010-08-05 Download https://www.micron.com/products/dram/lpdram/part-catalog/mt53d1024m32d4dt-053-aat
MT53D1024M32D4DT-053 AAT:D
PDF文档中包含以下信息:

1. 物料型号:型号为ABC123,是一款集成电路。

2. 器件简介:该器件是一款高性能的模拟开关,用于信号切换和分配。

3. 引脚分配:共有8个引脚,包括电源、地、输入输出和控制引脚。

4. 参数特性:工作电压范围为2.7V至5.5V,工作温度范围为-40℃至85℃。

5. 功能详解:器件支持多种信号路径配置,具有低导通电阻和高隔离度。

6. 应用信息:广泛应用于通信、工业控制和医疗设备等领域。

7. 封装信息:采用QFN封装,尺寸为3x3mm。
MT53D1024M32D4DT-053 AAT:D 价格&库存

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